Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(251)
3D IC and TSV technologies
(146)
Advanced Welding Techniques Analysis
(72)
Intermetallics and Advanced Alloy Properties
(30)
Aluminum Alloys Composites Properties
(29)
Affiliations
BGI Group (China)
Harbin University of Science and Technology
Beijing Foreign Studies University
Qiqihar University
Beijing Institute of Technology