Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(162)
3D IC and TSV technologies
(107)
Advanced Welding Techniques Analysis
(53)
Nanomaterials and Printing Technologies
(46)
Advanced Sensor and Energy Harvesting Materials
(39)
Affiliations
Harbin University
University of Waterloo
City University of Hong Kong
Huazhong Agricultural University
Harbin Institute of Technology