Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(18)
3D IC and TSV technologies
(11)
Aluminum Alloys Composites Properties
(6)
Synthesis and properties of polymers
(6)
Surface Modification and Superhydrophobicity
(5)
Affiliations
University of Idaho
Hohai University
Tiangong University
Chinese Academy of Sciences
Peking University