Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(12)
Epoxy Resin Curing Processes
(6)
3D IC and TSV technologies
(6)
Hip and Femur Fractures
(5)
Metallurgical and Alloy Processes
(5)
Affiliations
University of Electronic Science and Technology of China
Guangxi Medical University
Universität Ulm
Fudan University
Dalian University of Technology