Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(117)
3D IC and TSV technologies
(88)
Copper Interconnects and Reliability
(45)
Electrodeposition and Electroless Coatings
(37)
Gas Sensing Nanomaterials and Sensors
(32)
Affiliations
Wannan Medical College
Qingdao University
Shanghai University
Buffalo State University
Jiangsu University