Jun Wei
0000-0002-9583-1346
Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(95)
Additive Manufacturing and 3D Printing Technologies
(74)
3D IC and TSV technologies
(74)
Aluminum Alloys Composites Properties
(61)
Additive Manufacturing Materials and Processes
(57)
Affiliations
Harbin University of Science and Technology
Agency for Science, Technology and Research
Jiangsu University
Tongji University
New Jersey Institute of Technology