Hongbin Shi
0000-0002-5044-6807
Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(33)
3D IC and TSV technologies
(28)
Electromagnetic Compatibility and Noise Suppression
(9)
Material Properties and Processing
(8)
Advanced ceramic materials synthesis
(7)
Affiliations
Waseda University
Huawei Technologies (China)
Fudan University
China Aerospace Science and Technology Corporation
China Railway Fifth Survey and Design Institute Group