Publication & Citation Trends
Publications
0 total
No publications found.
Research Topics
Electronic Packaging and Soldering Technologies
(8)
3D IC and TSV technologies
(7)
Advancements in Solid Oxide Fuel Cells
(5)
High-Temperature Coating Behaviors
(5)
Copper Interconnects and Reliability
(5)
Affiliations
Materials Science & Engineering
State Key Laboratory of Materials Processing and Die & Mould Technology
Huazhong University of Science and Technology